Qualcomm is hiring for the role of Interim Engineering Intern!

Responsibilities of the Intern:

• Working with customers across industries — from automotive to health care, from smart cities to robotics — we continue to accelerate innovation and unlock new possibilities in a time where everything is connected.
• By joining the Qualcomm family, you too can bring the future forward faster.
• SOC & Hard Macro Physical Design
• SOC Validation & Debug
• RF & Analog Layout
• RF/Analog/Mixed Signal/Power IC Design
• Low Power Design
• Board and FPGA Design
• Digital ASIC Design
• Design/SOC Verification
• CAD Solution Engineer
• Design for Test (DFT)
• CPU Design

Requirements:

• Verifying SoC with embedded RISC/DSP processors, communications/networking ASICs
• Experience with Verilog or VHDL, C/C++, Tcl/Perl/shell-scripting
• RTL design experience and/or strong object-oriented programming knowledge
• Knowledge of wireless/wired communications and protocols or graphics/video multimedia is a plus
• Knowledge in PLL, LNA, OpAmp, CMOS, ADC/DAC, Cadence, SpectreRF, or Layout is required in RF/Analog/Mixed Signal IC Design
• Excellent analytical and problem-solving skills
• Ability to collaborate and work in teams
• Good verbal and written communication skills
• Master’s or Bachelor’s degree in Electrical Engineering, VLSI, Embedded and VLSI, or ECE